TSMC 3nm wafer demand remains strong in Y2024 with Apple’s continued strength.

July 14, 2023

Key Takeaways:

  • TSMC aims to expand its 3nm wafer capacities to 50-60K/m by the end of Y2023 and 90-100K/m by the end of Y2024, driven by robust orders and market shares from key customers.
  •  Apple is poised to become a significant client for TSMC's 3nm wafers, with projected wafer inputs of 300-400K in Y2023 and 800-900K in Y2024.
  • Qualcomm and Bitmain are also expected to be notable customers for TSMC's 3nm process, with anticipated wafer inputs of 100-200K and 50-100K, respectively, in Y2024.

 

Full insights are delivered in July 7th weekly report.

The information we shared is only a short excerpt of our monthly report. If you have further interest in our research and findings, we would be happy to provide you with a more detailed and comprehensive report that includes additional insights and data points. Please contact us to access our full insights.

Authors

Lucy Chen

Lucy Chen, Vice President at Isaiah Research, has been working 25+ years in semiconductor industry. Focus on semiconductor engineering and supply chain research. Master in Application Chemistry, NCTU, Taiwan Currently as the Vice President at Isaiah Research and lead semiconductor research team to work on the supply chain analysis from IC design and IDM(Qualcomm, MediaTek, Intel, etc) to foundries(TSMC, Samsung, UMC, GlobalFoundries, SMIC) and OSATs(ASE,SPIL). Business development and customer management including raw materials and equipment suppliers, top tier foundries and smartphone brands. Used to work as the Engineering Director at Lam Research for 15+ years and Director of Technology & Marketing at SEZ Group. Focus on process engineering, product strategies planning, supply chain and customer management including foundries and memory.

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