In our latest industry analysis, we explore a rare seasonal reversal in 2026 iPhone shipments. Driven by extended component lead times and robust iPhone 17 demand, we project Q2 shipments will uniquely surpass Q1 and potentially Q3. Forecasting 1H26 production at 120–122 million units, we believe this disrupted seasonality optimizes supply chain utilization.
With the continuous evolution of Advanced Packaging and heterogeneous integration technologies, Hybrid Bonding has become a critical pathway to break through I/O density limits and extend Moore's Law. According to observations by the Isaiah Research team, to achieve even smaller contact pitches (such as 400 nanometers or below), the industry is undergoing a comprehensive upgrade ranging from foundational materials to process equipment. Among these, the introduction of Silicon Carbonitride (SiCN) as a novel bonding dielectric material, alongside the co-optimization of Chemical Mechanical Planarization (CMP) and lithography overlay (LIT OVL error) technologies, will be core to determining the yield of future 3D ICs. This report synthesizes industry technological dynamics to deeply explore the profound impacts this technological turning point may bring to the semiconductor supply chain.
Looking back at global smartphone market shipments in recent years, 2023 bottomed out at 1.134 billion units, reached 1.181 billion units in 2024, and climbed to 1.22 billion units in 2025. However, entering 2026, the market faces severe challenges. Current estimates suggest shipments will drop significantly to 1.05 billion units, representing a steep year-over-year (YoY) decline of 13.9%. Some pessimistic forecasts even project the total volume could plunge to 900 million units. Despite the severe recession in the broader market, a significant polarization in global competition has emerged. Apple and Samsung are expected to buck the trend and deliver YoY growth this year. Their growth momentum primarily stems from the across-the-board decline of Chinese brands, allowing Apple and Samsung to harvest market share globally. Therefore, the extreme cost-reduction strategies and the supply chain "downgrading" trends discussed in this report primarily focus on an in-depth analysis of the survival rules for **Chinese brands** caught in this double squeeze.
With the comprehensive explosion of artificial intelligence applications, AI computing demand is devouring massive memory resources like a black hole, triggering a chain reaction of "Chipflation" across the semiconductor supply chain. According to supply chain checks and manufacturer data, our research team estimates that the total shipment volume of High Bandwidth Memory (HBM) is expected to experience staggering, explosive growth, surging from approximately 2.9 BGb (Billion Gigabit) in 2023 to a scale exceeding 34.3 BGb by 2026. Against the backdrop of multiple structural constraints within the supply chain—including tight wafer supply, limited cleanroom space, extended lead times for EUV lithography equipment, and bottlenecked advanced packaging capacities—it is currently observed that the tight memory supply situation may persist for several quarters or perhaps even years. This report analyzes the total HBM shipment growth in 2026, the shifting market shares among the top three memory manufacturers, and the consumption volumes and specification evolutions of major AI chip clients.
The 2026 iPhone production forecast has been revised upward to 260–270 million units, driven by stable pricing and supply chain advantages. Although 1H26 faces production shifts due to A19 processor constraints, robust demand for the iPhone 17 series is offsetting legacy model declines. The anticipated Q4 launch of the Foldable iPhone will further bolster shipment momentum, ensuring a strong performance for the second half of the year.
According to Isaiah Research estimates, TSMC's HPC (High-Performance Computing) business will reach a historic milestone in the first quarter of 2026 (1Q26), with single-quarter revenue poised to challenge the USD 20 billion mark. Overall HPC revenue is expected to see a solid Quarter-over-Quarter (QoQ) growth of approximately 7% to 9% (an increase of about USD 1.4 to 1.6 billion). The growth momentum has shifted from relying solely on a single customer's hardware iterations to being jointly driven by AI "hot-run" premiums and a massive surge in demand for custom ASICs
- **trong Shipment Momentum:** The estimated shipment volume of the MacBook Neo in 2026 is expected to reach **7 to 8 million units**, serving as the core engine driving the overall growth of Apple's laptop shipments. - **Low-Pricing Strategy Reshuffles the Market:** The $599 pricing will significantly capture the entry-level market share of traditional OEM giants and may also create a substitution effect for Apple's own tablets. - **Urgent Supply Chain Orders:** Orders for panels and camera modules have seen a significant upward revision, though the final volume performance will heavily depend on the capacity expansion flexibility of the assembly foundries.
In Q2 2026, the smartphone memory market has become an extreme seller's market, driven by suppliers prioritizing server demands and capacity crowding-out. Both DRAM and NAND prices are surging, with quarter-over-quarter increases reaching 70% to over 100%. Apple's aggressive procurement strategy has set a high pricing anchor, leaving Android manufacturers facing severe cost pressures and delayed negotiations. Looking ahead to Q3, Android brands anticipate even steeper price hikes, making hardware cost control a critical challenge for profitability.
Isaiah provides a comprehensive analysis of the iPhone production forecast for 2025 and 2026. While overall 2026 shipments are expected to remain flat or show slight growth compared to the 248 to 249 million units in 2025, the first half of 2026 will experience significant year-over-year production increases of 18 percent in the first quarter and 20 percent in the second quarter. This surge is primarily driven by strategic early pull-ins of the iPhone 17 Pro, alongside a minor baseline correction for the new iPhone Air model. We also explore upstream supply chain dynamics and future market drivers.
AI servers are driving HBM demand, triggering an unprecedented resource crowding-out effect in the memory industry. Major manufacturers are highly concentrating their capital and capacity on HBM, leading to a severe supply gap of 20 to 25 percent in traditional DRAM and NAND. As these giants shift their capital expenditures and launch fierce expansion and packaging layouts across the US, South Korea, Singapore, Japan, and Taiwan, the high-ASP (Average Selling Price) environment is expected to persist into 2026 to 2027. Mastering these geopolitical expansion dynamics is core to navigating the semiconductor super cycle and hedging risks.
We maintain our 2025 iPhone production forecast at 247–249 million units but observe significant adjustments for 1H26. Production volume is expected to rise as Apple strategically builds iPhone 17 inventory in 2Q26 to hedge against anticipated memory price hikes in the second half of the year. Consequently, 1Q26 will see a 13–18% YoY increase, driven by the iPhone 17 series. Additionally, the new iPhone 17e enters mass production at Foxconn in January 2026 with 7–9 million units planned, while the iPhone 13 and 14 will reach their end-of-life in 2Q26.
Reflecting on 2025, the global foldable smartphone market stagnated, with estimated shipments hovering between 14 million and 16 million units (YoY ~1%). However, 2026 will mark a major watershed moment. With Apple’s official entry into the fray, global foldable shipments are projected to jump to **19 million to 21 million units**, representing a massive annual growth rate of **35% to 37%**. Data models indicate that if Apple’s estimated contribution of 6 million to 7 million units is excluded, the Android camp may face a decline of 8% to 9%. This implies that 2026’s growth momentum will be driven entirely by Apple, forcing a drastic strategic restructuring across the Android ecosystem.