We are proud to share our latest research, which has uncovered several key insights that provide a new perspective on the current state and future trajectory of the market.

Key Takeaways Strategic Pivot to HBM/DRAM: Major suppliers (Samsung, SK hynix, Micron) are structurally reducing NAND capacity, with 2027 levels projected to be 40% lower than the 2022 peak. Capital and fab space are being diverted to high-margin, AI-driven HBM and advanced DRAM. Supply Constraints through 2026: Despite rising AI demand, vendors remain conservative due to 2023 losses. Since significant new capacity will not arrive until after 2027, the market will face a "tight supply-demand balance" through 2026. Focus on Technology Node Transition: The industry consensus is to meet demand through technology node transitions to increase bit density (Gb/mm²) rather than blindly building new wafer fabs. This technical upgrade drives bit output growth while maintaining supply discipline.

Key Takeaways: • Supply chain rebalancing: $16.5B Samsung deal reduces Tesla's TSMC reliance for next-generation chips while securing U.S.-based production • Architectural paradigm shift: AI6 enables vehicle-embedded Dojo capabilities, potentially eliminating training/inference hardware separation • Timeline convergence: 2028-2030 mass production aligns with Robotaxi commercialization and Cybercab platform requirements

Key Takeaways: • Material progression strategy: Systematic evolution from graphite→indium→liquid metal aligns with increasing power densities in R100/Venice/M4/M5 Ultra generation • Process complexity amplification: Liquid metal TIM demands UV-curable dielectric coating and six-sided AOI inspection, elevating manufacturing sophistication • Supply chain verticalization: In-house TIM control provides competitive differentiation while ensuring process reliability for premium HPC customers

Background: On March 3, TSMC announced plans to increase its investment in the United States by an additional $100 billion, bringing its total commitment to $165 billion. This expanded investment plan includes the construction of three new semiconductor fabrication plants, two advanced packaging facilities, and a major research and development center. However, these investments are likely to change as Taiwan communicates with the United States.
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Should Chinese chip designers win orders, they could still struggle for production capacity given constraints U.S. curbs put on foundries such as TSMC (2330.TW) from working with Chinese firms, said Isaiah Research Vice President Lucy Chen.

The waiver is “good news” for TSMC, as it allows the company to continue with expansion plans for its 28-nanometer chips in Nanjing, China, says Lucy Chen, vice president of Isaiah Research, a Taiwan-based tech-research firm.

Apple added five new mainland Chinese suppliers while removing eight in mainland China in its latest financial year ended September 2022, after China’s strict Covid-19 controls disrupted iPhone production last holiday season, according to the latest supplier list published by the US consumer electronics giant.

Foxconn may lose some iPhone 15 work to other Chinese manufacturers after it failed to deliver iPhone 14s last November due to Covid disruptions. New arrangement marks the first time Apple has tapped three suppliers to produce premium iPhones, highlighting efforts to smooth the supply chain
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